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Cadence Encounter Platform Deployed By STMicroelectronics' Audio Division to Meet XM Radio Tape-out Demands
Design Partner Accent Successfully Incorporates Last-Minute
Changes into 130-Nanometer Layout Implementation
SAN JOSE, Calif.—(BUSINESS WIRE)—Oct. 15, 2003—
Cadence Design Systems, Inc. (NYSE:CDN) today announced that
STMicroelectronics' Audio Division has successfully used Cadence(R)
Encounter(TM) digital IC design platform technologies to design its
extremely complex 130nm XM Radio digital baseband circuit.
STMicroelectronics' design partner Accent deployed SoC Encounter(TM)
to meet the original tape-out schedule for the XM Radio digital
baseband circuit, while successfully incorporating design changes.
"The move to smaller nanometer geometries increases the complexity
of chip development and requires advanced process technologies," said
Pietro Palella, general manager for STMicroelectronics' TPA Audio and
Automotive Group. "Working with Accent and deploying Cadence SoC
Encounter addressed our design needs comprehensively, which meant we
could tape out our demanding new circuit on time, despite late
changes."
The SoC Encounter RTL-to-GDSII system -- which encompasses the
full design flow, from virtual prototype to full implementation -- is
a core technology of the Cadence Encounter digital IC design platform
and supports 50+ million gate hierarchical designs. By combining SoC
Encounter with Accent's own silicon implementation expertise, Accent
dramatically improved the predictability of the design effort,
including the management of several engineering changes that occurred
toward the end of the implementation cycle. SoC Encounter's silicon
virtual prototype provided very fast feedback on chip performance and
a fully functional, physically feasible layout. This enabled the joint
ST and Accent design team to produce a signoff-quality floorplan and
preliminary placement optimized for rapid, reliable design closure,
and, in turn, enabled the team to meet its aggressive design schedule.
"In the fast-moving and highly competitive multimedia market,
meeting tight development schedules is crucial," said Guillaume
d'Eyssautier, vice president and general manager for Cadence Europe.
"The combined strengths of SoC Encounter in RTL-to-GDSII and Accent's
design expertise has delivered the XM Radio chip on time and to
specification, ultimately enabling ST to meet not just its aggressive
design schedules but its business goals as well."
"As a center of excellence for silicon implementation, we aim to
work with the most advanced tools to speed design flows," said Massimo
Vanzi, GM for Accent. "By providing realistic views of the chip faster
than other tools can, SoC Encounter enabled us to predict and control
the time it took to develop this circuit. In future designs, we will
reuse this flow and the experience we have gained to cut time to
tape-out and incorporate inevitable late design changes. And we can
accomplish all of that with a relatively small engineering team."
About Cadence
Cadence is the world's leader in electronic design technologies,
methodology services, and design services. Cadence solutions are used
to accelerate and manage the design of semiconductors, computer
systems, networking and telecommunications equipment, consumer
electronics, and a variety of other electronics-based products. With
approximately 5,000 employees and 2002 revenues of approximately $1.3
billion, Cadence has sales offices, design centers, and research
facilities around the world. The company is headquartered in San Jose,
Calif., and traded on the New York Stock Exchange under the symbol
CDN. More information about the company, its products and services is
available at www.cadence.com.
Cadence and the Cadence logo are registered trademarks and
Encounter and SoC Encounter are trademarks of Cadence Design Systems,
Inc. All other trademarks are the property of their respective owners.
Contact:
Cadence Design Systems, Inc.
Andrea Huse, +49 (0)89 4563 1726
ahuse@cadence.com
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